微結構封裝技術發展與應用
本研究提出利用高精密微量射出技術，使用一次光學微結構封裝取代傳統二次光學封裝，達到微型化之聚光型光學特性，因此被認為有高度應用潛力於系統級光引擎(light engine)介面，利用COB(chip on board)技術將多顆LED晶片置於光板上，並整合AC驅動IC於單一光引擎，可大幅縮減光引擎封裝體積、降低成本及製作時間，適合應用於單位面積高光通量之聚光型投光式光源。
The high-precision micro-injection technology is proposed in this study.
The idea is using the first optical package with micro-structure to replace the
secondary optical package. The spot radiation pattern can be achieved by the miniaturized
micro-structure package. It is considered to have a high degree of potential
for integrating the system-level light engine. Utilizing COB (chip on board)
technology to place multi-LED-chips on board and integrate AC driver IC in a
single light engine. The package volume, cost, and production time of light
engine can be significantly reduced. It is suitable for high luminous flux and
spot lighting applications.
關鍵字/Key Words
發光二極體(light-emitting-diodes,
LED)、 微結構(micro-structure), 光場型(radiation pattern)- Link:
- Taiwan Journals (台灣期刊):
王玫丹 ,黃忠民 , 微結構封裝技術發展與應用「工業材料」,(341),pp.92-96,20150505
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